Practical demands have fueled the development of electronic materials with skin-like properties in terms of stretchability, self-healing capability, and biodegradability. Guest Editors: Angel Yanguas-Gil, Ganesh Balakrishnan, Joshua D. Cladwell, Jamie Phillips, Joshua Zide, Michael Tiscler, John Baniecki, Suzanne Mohney, and Shadi Shahedipour-Sandvik, Special Section: 3D Printing. All submissions to the Journal of Electronic Materials must be within its scope, and advance scientific knowledge by addressing important questions relevant for the research of electronic materials. Guest Editors: Joshua Caldwell, Joshua Zide, Suzanne Mohney, Jamie Phillips, F. Shadi Shahedipour-Sandvik, Nadeem Mahadik, Fareed Qhalid, Suchi Guha, Rachel Goldman, Jian Xu, Angel Yanguas-Gil, Ganesh Balakrishnan, 2015 International Conference on Thermoelectrics. Volume 3, Issue 4. pp. Guest Editors: Joshua Caldwell, Rachel Goldman, Jamie Phillips, Oana Jurchescu, Shadi Shahedipour-Sandvik, Alberto Salleo, Grace Xing, and Jian Xu, Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies, Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XI, 2011 U.S. Workshop on the Physics and Chemistry of II-VI Materials, International Conference on Thermoelectrics 2011, Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials, 2010 U.S. Workshop on the Physics and Chemistry of II-VI Materials, International Conference on Thermoelectrics 2010, Special Issue: Pb-Free Solders and Emerging Interconnect and Packaging Technologies, Special Issue: Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials, Special Issue: International Conference on Thermoelectrics 2009, 2009 U.S. Workshop on the Physics and Chemistry of II–VI Materials, 2009 International Conference on Defects: Recognition, Imaging and Physics in Semiconductors (DRIP), Special Issue: Group III Nitrides, Silicon Carbide, and Zinc Oxide, 2008 U. S. Workshop on the Physics and Chemistry of II– VI Materials, Over 10 million scientific documents at your fingertips, Not logged in Journal of Electronic Materials. Guest Editors: Erol Kurt and Shadia Jamil Ikhmayies, 2017 International Conference on Thermoelectrics. Journal of Electronic Materials | Citations: 7,438 | Published jointly by IEEE and TMS. Phase Stability, Phase Transformation and Reactive Phase Formation in Electronic Materials. Guest Editor: Shih-kang Lin, Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2017. Effect of Ni Substitution on Optical Transitions and Magnetic Behavior of Mesoporous Ni, Gold-Doped Tin Oxide Film for Highly Sensitive Carbon Monoxide Sensing, Prediction of Magnetocaloric Effects of La, Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration, TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder, Asian Consortium AC–CMS International Conference ICMG 2020, Call for Papers: Progress and Challenges with Stability, Sustainability, Toxicity, and Scalability of Perovskite Materials and Devices, Reports on the science and technology of electronic materials, Examines new applications for semiconductors, magnetic alloys, insulators, and optical and display materials, Presents articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials, Publishes select papers from conferences, including the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics, Contains research on specific areas of interest such as materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications, Immediate online access with complete access to all articles, Current Contents Collections / Electronics & Telecommunications Collection, Current Contents/Physical, Chemical and Earth Sciences, EBSCO Applied Science & Technology Source, EBSCO Computers & Applied Sciences Complete, Institute of Scientific and Technical Information of China, Japanese Science and Technology Agency (JST), ProQuest Advanced Technologies & Aerospace Database, ProQuest Materials Science and Engineering Database, Science Citation Index Expanded (SciSearch). Guest Editors: S. Sivananthan and N.K. Guest Editors: Xinyu Liu and Aidong Shen; and 5th European Conference on Renewable Energy Systems. send feedback, Special Section: Progress and Challenges With Stability, Sustainability, Toxicity, and Scalability of Perovskite Materials and Devices. Guest Editors: Kyoung-sik (Jack) Moon, Raymond C. Rumpf, Namsoo P. Kim, and Seung-Kyum Choi, Special Sections from the 2014 TMS Annual Meeting: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII. The Journal of Electronic Materials is a journal of The Minerals, Metals & Materials Society (TMS) that: Reports on the science and technology of electronic materials; Examines new applications for semiconductors, magnetic alloys, insulators, and optical and display materials Find out more. The editor-in-chief is Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute.The IEEE/TMS Journal of Electronic Materials (JEM) is jointly sponsored by the IEEE Electron Devices Society and The Minerals, Metals and Materials Society. Guest Editors: Joshua Caldwell, Nadeem Mahadik, Parsian Mohseni, Jamie Phillips, Shadi Shahedipour-Sandvik, Randy Tompkins, Special Section: International Conference on Thermoelectrics 2019. - 162.241.236.251. Guest Editor: Hiroshi Nishikawa, Special Section: Electronic Materials for Renewable Energy Applications 2018, Special Section: U.S. Workshop on the Physics and Chemistry of II-VI Materials 2018, Special Section: Progress and Challenges for Emerging Integrated Energy Modules, Special Section: 60th Electronic Materials Conference 2018. Guest Editors: Erol Kurt, Shadia Ikhmayies, and Ibrahim Sefa, The Third International Conference on Advanced Materials and Nanotechnology (ICAMN 2016) and The International Workshop on Advanced Materials and Nanotechnology (IWAMN 2016). Dhar, Special Section: Third European Conference on Renewable Energy Systems. Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2019, Special Section: 18th Conference on Defects-Recognition, Imaging and Physics in Semiconductors (DRIP XVIII). Dhar, 2012 International Conference on Thermoelectrics. Guest Editors: Wojciech M. Jadwisienczak, Faiz Rahman, and Dan Ricinschi, Special Section: International Electron Devices and Materials Symposium 2019. In addition to original research papers, review papers are published on current topics in order to enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. © 2020 Springer Nature Switzerland AG. - 85.92.70.121. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. A selection of key articles from the journal, all of which are free to read. 2011 Electronic Materials Conference. 58th EMC Special Section: 2016 Electronic Materials Conference, 2015 U.S. Workshop on the Physics and Chemistry of II-VI Materials. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang, European Conference on Thermoelectrics 2013. Guest Editors: S. Sivananthan and N. K. Dhar, International Conference on Thermoelectrics 2013. Part of Springer Nature. Latest issues. 131–186 (December 2017) Volume 3, Issue 3. pp. Guest Editors: Lasse Rosendahl, Donald Morelli, Jihui Yang, Hiroaki Anno, Matt Beekman, Jan D. Koenig, Xinfeng Tang, James R. Salvador, Bertrand Lenoir, Chunlei Wan, Jeff Sharp, Emmanuel Guilmeau, Hsin Wang, Jing-feng Li, Tie-Jun Zhu, David Singh, Ryoji Funahashi, Yuri Grin, and Wenqing Zhang, 2014 Electronic Materials Conference.
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